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We specialize in engineering high quality composites for management of heat in electronics packages, particularly Integrated Circuit (IC) packaging. These composite materials are comprised of Molybdenum Copper (AMC) and Tungsten Copper (AWC). Turnkey Solution for Production Ready Pedestals Our advanced thermal management materials are offered both in a raw form such as block or sheet for finished machining at our customers’ facilities or their sub-tier suppliers. We also offer turnkey finished products completed through machining, plating and customer specified packaging. Sizes Our heat spreader materials for IC packages are offered in a wide breadth of sizes including: Standard blocks of 3” (76 mm) x 4” (102 mm) x 12” (304.8mm) Down to finished machined and plated products in 0.015” (0.381mm) cubes Hermetic Housings and Heat Sinks These thermal management products are used as both the hermetic housings and as the expansion-matched

We manufacture bar and tube products in our corrosion resistant Spinodal alloy, Pfinodal® (C72900), for use in downhole housings, centralizers, and joints that operate in demanding subsea environments. Advantages Our Copper nickel tin Pfinodal® (C72900) bar and tube products present a combination of unique properties that deliver significant advantages for downhole oil and gas applications. Non-sparking and non-magnetic Anti-galling Anti-corrosive Heat treatable to high hardness Safe alternative to Beryllium Copper (BeCu) Pfinodal ® (C72900) Bar and Tube C72900 copper alloy materials are available in bar and tube sizes up to 6” (152.4mm) diameters as well as in both strip and plate products. Our C72900 material is generally provided as machining bar in the aged condition with many sizes available to ship from inventory. We also offer the ability to provide turnkey solutions by providing fully machined parts to OEM drawings.